Dunno. This works for me without damaging the parts, pads, or traces. Your link is for PCBA reflow ovens. Talks about minutes long of exposure. I'm using a Atten ST-862D hot air station with questionable temperature and airflow accuracy. For an M.2 drive I'll probably soak 225 for 15 seconds 3 times the size of the chip areas in circles. Hit my memory-1 button to go to 400 and focus on the chip for 3 seconds. Hit memory-2 to go down to 300 and one up arrow for 325 for 5 more seconds while watching nearby caps' solder pads and ensuring they don't fly away. ¯\_(ツ)_/¯

Yes, those temps are absolutely sane for hot air. You didn't specify that.

The trick is staying below the chip's rated processing temps because many of these temps are far too high and could easily lead to semiconductor degradation, especially with the mechanical shock of thermal stresses from rapid or uneven heating and cooling. Hot air is far more uneven and uncontrolled than a BGA oven.

That sounds low, unless you are using one of the commercial brands notorious for displaying too-low temperatures (so that their iron/air/oven will be "the good one" that works when others don't).

According to that datasheet peak temp should be above 245C for at least 20s.